RELIABILITYTEST CONDITIONS
WIREWOUNDCHIPINDUCTORSTYPE
FORSMD322522/453232/SMTSDR322520/453226/SMDCHGR0603/0805/1008/1210/SMDFSR1008/SMTS |
| Item(項目) | RequiredCharacteristics (要求) | TestMethod/Condition (測試方法) |
High temperature Storage test
Reference documents:
MIL-STD-202G Method 108A
高溫儲存試驗 | 1.No case deformation or
change in appearance.
2.ΔL/L≦10%
3.ΔQ/Q≦30%
4.ΔDCR/DCR≦10%
1.無明顯的外觀缺陷
2.感值變化不超過10%
3.品質因數變化不超過30%
4.直流電阻變化不超過10% | Temperature:85±2℃Time:96±2hours Tested not less than 1hour,normorethan2hoursatroomtemperature.  溫度: 85±2℃,時間: 96±2,小時樣品在室溫 下放置1小時, 不 超2小時間必須測試. |
Low temperature Storage test
Referencedocuments:
IEC 68-2-1A 6.1 6.2
低溫儲存試驗 | 1.Nocasedeformationorchangeinappearance.
2.ΔL/L≦10%
3.ΔQ/Q≦30%
4.ΔDCR/DCR≦10%
1.無明顯的外觀缺陷
2.感值變化不超過10%
3.品質因數變化不超過30%
4.直流電阻變化不超過10% | Temperature: -25±2℃ Time : 96±2 hours
Tested not less than 1hour,normorethan2hoursatroomtemperature.
溫度: -25±2℃,時間:96±2,小時
樣品在室溫下放置1小時,不超2小
時間必須測試. |
Humidity test Reference
documents: MIL-STD-202G Method 103B
濕度測試 | 1.No case deformation or change in appearance.
2.ΔL/L≦10%
3.ΔQ/Q≦30%
4.ΔDCR/DCR≦10%
1.無明顯的外觀缺陷
2.感值變化不超過10%
3.品質因數變化不超過30%
4.直流電阻變化不超過10% | 1. Dry oven at a temperature of 40° ±5°C
for 24 hours.
2. Measurements At the end of this period
3. Exposure:Temperature: 40±2℃ ,Humidity:93±3%RHTime:96±2hours
4. Tested while the specimens are still in the chamber
5. Tested not less than 1 hour, nor more
than 2 hours at room temperature.
1.樣品必須先在40° ±5°條件下乾燥24小時
2.乾燥後測試
3.暴露: 溫度:40±2℃ , 濕度: 93±3%RH 時間 :
96±2 hours
4.暴露結束後,在試驗箱中進行測試.
5.樣品在室溫下放置1小時,不超2小
時間必須測試. |
Thermal shock test
Reference documents:
MIL-STD-202G Method 107G
熱衝擊測試 | 1.Nocasedeformationorchange in appearance.
2.ΔL/L≦10%
3.ΔQ/Q≦30%
4.ΔDCR/DCR≦10%
For T: weight≦28g : 15Min; 28g≦weight≦136g : 30Min
1.無明顯的外觀缺陷
2.感值變化小於10%
3.品質因數變化小於30%
4.直流電阻變化小於10% | First-40℃forTtime,last125℃Ttimeas1cycle.Gothrough20cycles.
從-40℃作用T分鐘,然後溫度衝擊到125℃
作用T分鐘, 作為一個循環,共作用20次 |